High Heat Diamond Cu Composite Material Low Price

• Customization: Available
• Color: Yellow
• Hardness: 10
• Process Type: Diamond Cu
• Material: Diamond
• Usage: Heat
• Transport Package: Plastic Bottle
• Specification: 1-20mm
• Trademark: chenguang
• Origin: Hunan, China
• HS Code: 71049019
• Production Capacity: 5000 PCS/Month
• Package Size: 20.00cm * 20.00cm * 10.00cm
• Package Gross Weight: 0.500kg

Product Description

High Heat Diamond Cu Composite material low price
 

Diamond Cu Composite Material
Diamond/Cu is a high-performance composite material composed of diamond particles and copper substrate, which combines the ultra-high thermal conductivity of diamond and the excellent conductivity of copper. It is widely used in the heat dissipation field of high-power electronic devices.


Specification parameters:
Ultra high thermal conductivity: Diamond is the material with the highest thermal conductivity in nature (about 2000 W/m · K), while copper has a thermal conductivity of about 400 W/m · K. Diamond copper composite materials have a thermal conductivity of up to 500-1000 W/m · K, significantly better than pure copper and suitable for extreme heat dissipation needs.

Low thermal expansion coefficient: Diamond has a low thermal expansion coefficient (1 × 10-6/K) and copper has a thermal expansion coefficient (17 × 10-6/K). By adjusting the diamond content (usually 40% -70% volume fraction), the thermal expansion coefficient can be reduced to 5-8 × 10-6/K, which matches semiconductor materials such as Si and GaAs and reduces thermal stress.

Lightweight: Diamond has a low density (3.5 g/cm ³) and composite material density (about 5-6 g/cm ³), which is lower than pure copper (8.96 g/cm ³).

High heat resistance: can withstand high temperature working environment (copper melting point 1083 ºC, diamond is stable above 700 ºC in an inert atmosphere).



Application case:
·Electronic heat dissipation: CPU/GPU heat sink, IGBT module substrate, laser diode heat sink.
·Aerospace: Lightweight heat dissipation components for high-power devices such as satellites and radars.
·5G communication: thermal management materials for base station RF modules.
·New energy vehicles: power semiconductor (such as SiC devices) heat dissipation substrates for electric vehicles.
 

Parameter	CVD Single Crystal Diamond	CVD Polycrystalline Diamond	Diamond Coated Copper  Plate	Diamond CU Composite Material
Thermal conductivity (W/m·K)	1800-2200	1200-1500	600-1200	500-800
Coefficient of Thermal Expansion (10^-6/K)	1.0	1.0-1.2	3-6	6.5-8
Specific Heat Capacity (J/g·K)	0.52	0.52	/	/
Density (g/cm^3)	3.52	3.52	4.8-5.5	5-7
Bending Strength (MPa)	1500-2500	800-1200	500-800	200-500
Insulation Performance	Insulation	Insulation	Insulation/Conduction	Conduction
Hardness (Mohs)	10	9.5	N/A	N/A
Thickness (mm)	0.3-5.0	0.5-3.0	Diamond Layer 0.3-1.0 Copper layer 0.01-0.5	Diamond Content 30-50%  Copper Content 50-70%
Size	Diameter 5-25 mm Customizable	Diameter 5-150 mm Customizable	On Demand Customization	On Demand Customization
Transparency	High Transparency	Low Transparency	N/A	N/A
Chemical Stability	Very Good	Very Good	Good	Good
Application Field	Laser, High-power Electronic devices, Optical Equipment	High Power Electronic devices, LED lighting, Industrial Processing	High Power Electronic Devices, Power Modules, Microelectronic Devices	High-frequency Devices, Laser Diodes, Microelectronic Devices

MONO/SINGLE CRYSTALLINE

 
Size:- 1X 1 mm to 8 X 8 mm,10-12mm
Thickness:- 0.3mm to 3mm
 
Grade and application
 

• Industry (for Mechanical applications, Making Wheel Dresser,die Blank,etc.)
• Electronic (for Quantum optics, radiation detector, etc.)
• Optical(for precision tools, window, anvil, sensor, etc.)
• Thermal/Mechanical (for conventional tools)

Surface

• As Grown or Laser Cut
• Polished (Ra< 5nm, Flatness < 1 fringes @ 633nm)
• Lapped (Ra< 200nm, Flatness < 1 fringes @ 633nm)

Type/Orientation

• Top (100), Customized for Scalpels (based on 2 and 4 point configuration)
• Customized shapes (based on given designs)

Edges

• Laser cut and  both polished

Crystal growth process:	Mono CVD diamond
Color:	Normal grade - Near colorless, Mechanic grade - Brown
Advantage:	1) Regular shape, uniform size. The size can be strictly controlled according to customer needs.
	2) High repurchase rate and high cost performance, well received by customers.
	3) No visible growth lines,under 100x microscope, no black spots, no impurities, no crack.
	4) The stress is good, the number of times of reuse is high, and it is not easy to crac
Size	7*7  8*8  9*9  10*10 11*11  12*12   Thickness: 0.05-3mm
^Orientation:	^4pt/100
Shape:	Square,Triangles, rectangles, swords
Lateral Dimensions Measured	to smaller side
Edges	Laser Cut
Laser Kerf	< 3°
Lateral Tolerance:	+0.1/-0 mm
Roughness, Ra	1. Two sides polished, Ra <10- 30 nm
	2. One side polished, the other size is The other side is the cutting surface, or grow
	3.Both sides are unpolished

Customized shape and size are available!
 
Application
a, cutting tools for non-ferrous and non-metallic materials.
b, dressers for wheel dressing
c, a variety of speciallity knives
d,  burnishing tools, cutting tools
e, wear parts
f, wire drawing dies
g, optical window