Customized Gold/Silver Plated Diamond Microchannel Cooler, CVD Monocrystalline Substrate for Electronic Packaging

• Customization: Available
• Color: White
• Hardness: 10
• Process Type: CVD
• Material: Diamond
• Usage: Tools
• Transport Package: Plastic Bottle
• Specification: 2-20mm
• Trademark: chenguang
• Origin: Hunan, China
• HS Code: 71049019
• Production Capacity: 5000 PCS/Month
• Package Size: 20.00cm * 20.00cm * 10.00cm
• Package Gross Weight: 0.500kg

Product Description

 Customized Gold/Silver Plated Diamond Microchannel Cooler, CVD Monocrystalline Substrate for Electronic Packaging

"Solder-ready, plug-and-play cooling for the world's hottest chips."
Super high thermal conductivity (4-5x copper)
Ready to solder (silver coated)
Liquid cooling built-in (microchannels)
No cracking (matches chip expansion)

CVD Single-Crystal Diamond Microchannels
Introduction:
CVD single-crystal diamond microchannels are micron-scale fluid channel structures precision-engineered onto single-crystal diamond substrates via chemical vapor deposition. They combine the ultimate material properties of single-crystal diamond with the enhanced heat transfer characteristics of microchannel architecture, representing a revolutionary breakthrough in thermal management technology.

Core Applications:
Next-Generation Chip Cooling: Direct cooling for 5G/6G RF chips, AI processors, and high-power lasers, addressing kilowatt-level heat flux dissipation challenges.
Aerospace & Defense: Active cooling systems for missile seekers, phased array radar T/R modules, and directed energy weapons.
Quantum & Sensing: Quantum sensing chips integrated with NV centers for microfluidic magnetic detection of live specimens.
Extreme Chemical Processing: Microreactors for supercritical fluids and high-throughput catalyst screening chips.


Key Advantages:
Ultimate Heat Transfer: Thermal conductivity (2200 W/mK) is 5 times that of copper, with demonstrated cooling capacity >1000 W/cm².
Extreme Reliability: Withstands high temperatures (>600°C), high pressure (>100 MPa), and resists plasma erosion.
Chemical Inertness: Resistant to all acids and bases, compatible with biological samples and reagents.
Monolithic Structure: No interfacial thermal resistance, eliminating delamination risks inherent in traditional composite materials.

This is the ultimate heat dissipation solution currently known in the material system, featuring the highest thermal conductivity, the most compatible thermal expansion, and the realization of 'fluid channel integration'. It is specifically designed to address the heat dissipation challenges of 'the last few hundred watts' in AI computing power and laser communication. The silver plating process ensures its seamless integration into your existing packaging process.

MONO/SINGLE CRYSTALLINE

 
Size:- 1X 1 mm to 8 X 8 mm,10-20mm
Thickness:- 0.3mm to 3mm
 
Grade and application
 

• Industry (for Mechanical applications, Making Wheel Dresser,die Blank,etc.)
• Electronic (for Quantum optics, radiation detector, etc.)
• Optical(for precision tools, window, anvil, sensor, etc.)
• Thermal/Mechanical (for conventional tools)

Surface

• As Grown or Laser Cut
• Polished (Ra< 5nm, Flatness < 1 fringes @ 633nm)
• Lapped (Ra< 200nm, Flatness < 1 fringes @ 633nm)

Type/Orientation

• Top (100), Customized for Scalpels (based on 2 and 4 point configuration)
• Customized shapes (based on given designs)

Edges

• Laser cut and  both polished

 

Size of CVD diamond plates: 

1*1*1mm , 2*2*1mm , 3*3*1mm , 4*4*1mm , 5*5*1mm , 6*6*1mm,
7*7*1mm , 8*8*1mm ,9*9*1mm ,10*10*1mm ,11*11*1mm ,12*12*1mm
 

Thickness of diamond plates:from 0.1mm to 3mm 
Customized shape and size are available!
 
Application
a, cutting tools for non-ferrous and non-metallic materials.
b, dressers for wheel dressing
c, a variety of speciallity knives
d,  burnishing tools, cutting tools
e, wear parts
f, wire drawing dies
g, optical window